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How Intel's CEO Lip-Bu Tan revived the chipmaker's struggling future

From near-collapse to TSMC rival: Intel's bold turnaround under a CEO who slashed bureaucracy and rebuilt trust. Can they keep the momentum?

The image shows a graph depicting the increased BAA issuance across industry groups. The graph is...
The image shows a graph depicting the increased BAA issuance across industry groups. The graph is accompanied by text that provides further information about the data.

How Intel's CEO Lip-Bu Tan revived the chipmaker's struggling future

Intel has made a strong recovery under CEO Lip-Bu Tan, who took charge when the company’s 18A chip yields were struggling. His leadership has brought clearer direction, improved efficiency, and better financial results. The turnaround has also positioned Intel to compete directly with industry leader TSMC by 2029. When Tan became CEO, Intel’s 18A process faced serious yield problems. He responded by cutting bureaucracy, simplifying the technology roadmap, and working closely with engineering teams. This hands-on approach led to a steady 7-8% monthly improvement in yields.

Tan also blamed past management for creating too many silos, which slowed progress. By restructuring decision-making and collaborating with ecosystem partners, he helped stabilise production. His efforts have since reflected in Intel’s financial performance, reinforcing confidence in the company’s direction. Looking ahead, Intel’s 14A process will enter risk production in 2028, with full-scale manufacturing starting in 2029—matching TSMC’s schedule. The technology will even support Elon Musk’s Terafab project, highlighting its growing industry relevance. Tan has credited Intel’s teams for their hard work while stressing the importance of rebuilding trust with customers. Intel’s partnerships, including one with Nvidia, further strengthen its position. These moves signal a more competitive future for the chipmaker after years of setbacks.

Intel’s recovery under Tan has restored its standing in the semiconductor industry. With improved yields, a clearer roadmap, and key partnerships, the company is now on track to rival TSMC by 2029. The success of its 14A and 18A processes will determine whether this momentum continues.

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